Mold and transfer molding apparatus

ABSTRACT

According to one embodiment, a mold includes a substrate clamping surface, a cavity, a suction part, a vent, an intermediate cavity, and an opening/closing part. The substrate clamping surface contacts a surface of a processing substrate. The cavity is recessed from the substrate clamping surface. The suction part is recessed from the substrate clamping surface. The vent is provided on a path between the cavity and the suction part, communicates with the cavity, is recessed from the substrate clamping surface to a vent depth. The intermediate cavity is provided between the vent and the suction part on the path, communicates with the vent, and is recessed from the substrate clamping surface to an intermediate cavity depth deeper than the vent depth. The opening/closing part opens and closes the path and is provided between the intermediate cavity and the suction part on the path.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is based upon and claims the benefit of priority fromJapanese Patent Application No. 2016-052652, filed on Mar. 16, 2016; theentire contents of which are incorporated herein by reference.

FIELD

Embodiments described herein relate generally to a mold and a transfermolding apparatus.

BACKGROUND

For example, there is a semiconductor device or the like in whichmultiple stacked semiconductor elements are sealed with a resin, etc.For example, such a semiconductor device is manufactured by a transfermolding apparatus using molds. For example, molding defects occur if theresin is not filled appropriately. A mold and a transfer moldingapparatus that have good moldability are desirable.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic cross-sectional view illustrating a mold and atransfer molding apparatus according to an embodiment;

FIG. 2A and FIG. 2B are schematic views illustrating the mold accordingto the embodiment;

FIG. 3 is a flowchart illustrating the operation of the transfer moldingapparatus according to the embodiment;

FIG. 4 is a schematic cross-sectional view in order of the processes,illustrating the operation of the transfer molding apparatus accordingto the embodiment;

FIG. 5 is a schematic cross-sectional view in order of the processes,illustrating the operation of the transfer molding apparatus accordingto the embodiment;

FIG. 6 is a schematic cross-sectional view in order of the processes,illustrating the operation of the transfer molding apparatus accordingto the embodiment;

FIG. 7 is a schematic cross-sectional view in order of the processes,illustrating the operation of the transfer molding apparatus accordingto the embodiment;

FIG. 8 is a schematic cross-sectional view in order of the processes,illustrating the operation of the transfer molding apparatus accordingto the embodiment; and

FIG. 9A to FIG. 9F are schematic plan views illustrating the moldaccording to the embodiment.

DETAILED DESCRIPTION

According to one embodiment, a mold includes a substrate clampingsurface, a cavity, a suction part, a vent, an intermediate cavity, andan opening/closing part. The substrate clamping surface contacts asurface of a processing substrate. The cavity is recessed from thesubstrate clamping surface. The suction part is recessed from thesubstrate clamping surface. The vent is provided on a path between thecavity and the suction part, communicates with the cavity, is recessedfrom the substrate clamping surface to a vent depth, and is used as anexhaust path of a gas inside the cavity. The intermediate cavity isprovided between the vent and the suction part on the path, communicateswith the vent, and is recessed from the substrate clamping surface to anintermediate cavity depth deeper than the vent depth. Theopening/closing part opens and closes the path and is provided betweenthe intermediate cavity and the suction part on the path.

According to one embodiment, a transfer molding apparatus includes themold, a transfer part introducing a resin to the mold, and a sensor. Thetransfer part fills the resin into the cavity in an open state of theopening/closing part. The sensor senses that at least a portion of theresin has passed through the vent and reached at least a portion of theintermediate cavity. The opening/closing part is set to a closed stateafter the sensing by the sensor.

Various embodiments will be described hereinafter with reference to theaccompanying drawings.

The drawings are schematic and conceptual; and the relationships betweenthe thickness and width of portions, the proportions of sizes amongportions, etc., are not necessarily the same as the actual valuesthereof. Further, the dimensions and proportions may be illustrateddifferently among drawings, even for identical portions.

In the specification and drawings, components similar to those describedor illustrated in a drawing thereinabove are marked with like referencenumerals, and a detailed description is omitted as appropriate.

FIG. 1 is a schematic cross-sectional view illustrating a mold and atransfer molding apparatus according to an embodiment.

FIG. 2A and FIG. 2B are schematic views illustrating the mold accordingto the embodiment.

FIG. 1 corresponds to a line A1-A2 cross section of FIG. 2A. FIG. 2A isa plan view as viewed along arrow AA of FIG. 1. FIG. 2B is across-sectional view corresponding to a line B1-B2 cross section of FIG.2A.

As shown in FIG. 1, the mold 10M according to the embodiment includes afirst mold 10 and a second mold 20. A major surface 10 a of the firstmold 10 is disposed to oppose a major surface 20 b of the second mold20. FIG. 1 shows an example of a state in which the two molds areseparated from each other.

In the example, a processing substrate 71 of a processing object 70 isdisposed on the major surface 20 a of the second mold 20. For example, asemiconductor chip 72 is provided on the processing substrate 71. Theprocessing substrate 71 and the semiconductor chip 72 are a portion ofthe semiconductor device to be manufactured.

In the embodiment, the processing substrate 71 may be disposed on thefirst mold 10; and the second mold 20 may be disposed on the processingsubstrate 71. In the embodiment, the processing substrate 71 may bedisposed on the second mold 20; and the first mold 10 may be provided onthe processing substrate 71.

A direction from the second mold 20 toward the first mold 10 is taken asa Z-axis direction. One direction perpendicular to the Z-axis directionis taken as an X-axis direction. A direction perpendicular to the Z-axisdirection and the X-axis direction is taken as a Y-axis direction. Forexample, the major surfaces of the molds spread along the X-Y plane.

As shown in FIG. 2A, a gate-side mold clamping part and a gate-sidesubstrate clamping part are provided in the mold 10M. A vent-side moldclamping part and a vent-side substrate clamping part are provided inthe mold 10M. The processing substrate 71 is disposed between the twomolds; and, for example, the surfaces of the substrate clamping partscontact the processing substrate 71 in the state in which the two moldsare closed.

FIG. 2B shows the state in which the two molds are closed.

As shown in FIG. 1 and FIG. 2B, the first mold 10 has a substrateclamping surface 11 (the surface of the substrate clamping part). Asshown in FIG. 2B, the substrate clamping surface 11 contacts a surface11 a of the processing substrate 71 when the processing substrate 71(the processing object 70) is disposed between the first mold 10 and thesecond mold 20. The processing substrate 71 is clamped by the substrateclamping surface 11 and the surface (the major surface 20 a) of thesecond mold 20.

As shown in FIG. 1, recesses are provided in the major surface 10 a ofthe first mold 10. A resin 40 is introduced to the recesses. Thesemiconductor device is made by the resin 40 being formed into aconfiguration corresponding to the configurations of the recesses.

In the example, a cull 10 u, a runner 10 r, a gate 10 g, a cavity 10 c,a vent 10 v, an intermediate cavity 10 d, and a suction part 10 e areprovided as the recesses in the major surface 10 a of the first mold 10.These parts are regions recessed from the flat portion (the substrateclamping surface 11) of the major surface 10 a of the first mold 10.These parts communicate with each other.

In the example, an opening/closing part 12 is provided in the first mold10. The opening/closing part 12 is, for example, a shut-off pin. Adriving part 12 d that operates the opening/closing part 12 is provided.For example, a state in which the recesses communicate with the outsideand a state in which the recesses do not communicate with the outsideare formed by the operation of the opening/closing part 12 by thedriving part 12 d.

The suction part 10 e communicates with one end of a suction path 20 p.Another end of the suction path 20 p communicates with a depressurizingapparatus (e.g., a not-illustrated depressurizing pump, etc.).

As described below, the processing object 70 is disposed between the twomolds; the molds are caused to approach each other; and the molds areset so that portions of the two molds contact each other. For example,when the opening/closing part 12 is in the open state, the gas (e.g.,air) that is inside the cavity 10 c is exhausted via the vent 10 v, theintermediate cavity 10 d, the suction part 10 e, and the suction path 20p. The suction part 10 e is, for example, an air suction part. The resin40 is introduced to the cavity 10 c having the gas exhausted from theinterior of the cavity 10 c. In the example, the suction path 20 p isprovided in the second mold 20. In the embodiment, the suction path 20 pmay be provided in the first mold 10.

The resin 40 is introduced via a pot 23 provided in the mold 10M. In theexample, the pot 23 is provided in the second mold 20. In theembodiment, the pot 23 may be provided in the first mold 10. The resin40 is filled from the pot 23.

A transfer molding apparatus 110 according to the embodiment includesthe mold 10M, a transfer part 31, and a sensor 50. A plunger 32 and acontroller 60 are provided in the example. For example, the controller60 controls the exhaust of the gas from the space inside the mold 10Mvia the suction part 10 e and controls the introduction of the resin 40to the space inside the mold 10M based on the operation of the transferpart 31.

At least a portion of the pot 23 has, for example, a tubularconfiguration. The plunger 32 is disposed in the interior of the pot 23.The resin 40 is disposed at an end part of the plunger 32. For example,the transfer part 31 is movable vertically (along the Z-axis direction).An initial position 31 q is the position of the bottom part of thetransfer part 31 in the initial state. The position of the bottom partof the transfer part 31 becomes a post-movement position 31 p by thetransfer part 31 moving in the upward direction. The difference betweenthe post-movement position 31 p and the initial position 31 q is amovement height 31 h. By the movement of the transfer part 31, theplunger 32 moves; and the resin 40 is supplied to the interior of themold 10M (i.e., between the first mold 10 and the second mold 20).

For example, the resin 40 is introduced to the cull 10 u when theopening/closing part 12 is in the open state. The resin 40 that passesthrough the cull 10 u passes through the runner 10 r and reaches thegate 10 g. Subsequently, the resin is introduced to the cavity 10 c. Forexample, the opening/closing part 12 is set to the closed state when theresin 40 reaches the vent 10 v and the intermediate cavity 10 d. Thecavity 10 c, the vent 10 v, and the intermediate cavity 10 d become asealed space; and the resin 40 is filled into these parts at a highpressure.

Thus, the mold 10M (in the example, the first mold 10) according to theembodiment includes the substrate clamping surface 11, the cavity 10 c,the suction part 10 e, the vent 10 v, the intermediate cavity 10 d, andthe opening/closing part 12. The substrate clamping surface 11 contactsthe surface 71 a of the processing substrate 71 (referring to FIG. 2B).The cavity 10 c is recessed from the substrate clamping surface 11(referring to FIG. 1). The suction part 10 e is recessed from thesubstrate clamping surface 11 (referring to FIG. 1).

The vent 10 v is provided on a path 10 p between the cavity 10 c and thesuction part 10 e (referring to FIG. 1 and FIG. 2A). The vent 10 vcommunicates with the cavity 10 c and is used as the exhaust path of thegas inside the cavity 10 c. The cavity 10 c is recessed from thesubstrate clamping surface 11 to a cavity depth Dc (referring to FIG.1).

The intermediate cavity 10 d is provided between the vent 10 v and thesuction part 10 e on the path 10 p. The intermediate cavity 10 dcommunicates with the vent 10 v. The intermediate cavity 10 d isrecessed from the substrate clamping surface 11 to an intermediatecavity depth Dd. The intermediate cavity depth Dd is deeper than a ventdepth Dv (referring to FIG. 1).

The opening/closing part 12 (e.g., the shut-off pin) is provided betweenthe intermediate cavity 10 d and the suction part 10 e on the path 10 p.For example, the opening/closing part 12 performs at least one of avertical operation or a rotation operation. Thereby, the opening/closingpart 12 is able to open and close the communicating portion between theintermediate cavity 10 d and the suction part 10 e.

For example, there is a reference example in which the deep intermediatecavity 10 d recited above is not provided. In the reference example, theopening/closing part 12 is set to the open state; the resin 40 isintroduced to the cavity 10 c of the mold 10M; the opening/closing part12 is set to the closed state after the resin 40 passes through the vent10 v; and a high pressure is applied to the resin 40. In the case wherethe timing of switching the opening/closing part 12 from the open stateto the closed state is inappropriate, for example, unfilled portions ofthe resin 40 or leaking of the resin 40 occurs. In the referenceexample, there are cases where the moldability is insufficient.

Conversely, the intermediate cavity 10 d is provided in the embodiment.The intermediate cavity depth Dd is set to be deeper than the vent depthDv. Thereby, for example, the velocity of the resin 40 passing throughthe vent 10 v becomes slower in the intermediate cavity 10 d. Thereby,the margin of the timing of switching the opening/closing part 12 toobtain the appropriate molding state is enlarged. For example, theunfilled portions of the resin 40 and the leaking of the resin 40 can besuppressed. According to the embodiment, a mold and a transfer moldingapparatus that have good moldability can be provided.

In the embodiment, in the case where the gate 10 g is provided, the gate10 g is set to be deeper than the depth of the vent 10 v. In otherwords, the mold 10M (the first mold 10) further includes the gate 10 gthat is recessed from the substrate clamping surface 11 to a gate depthDg (referring to FIG. 1). The cavity 10 c is provided in at least aportion between the gate 10 g and the vent 10 v. The vent depth Dv isshallower than the gate depth Dg.

For example, the gate depth Dg is greater than 150 μm, e.g., 250 μm orless. On the other hand, the vent depth Dv is not less than 10 μm andnot more than 150 μm. By setting the vent depth Dv to be shallower thanthe gate depth Dg, for example, both the effect of damming the resin 40and the exhaust effect of the gas (the air) can be realized. Thereby,good fillability is obtained.

The transfer molding apparatus 110 according to the embodiment includesthe mold 10M, the transfer part 31 that introduces the resin 40 to themold 10M, and the sensor 50 recited above. The transfer part 31 fillsthe resin 40 into the cavity 10 c when the opening/closing part 12 is inthe open state. The sensor 50 senses that at least a portion of theresin 40 has passed through the vent 10 v and reached at least a portionof the intermediate cavity 10 d. The opening/closing part 12 is set tothe closed state after the sensing by the sensor 50. For example, thetransfer part 31 sets the pressure applied to the resin 40 in the closedstate to be higher than the pressure applied to the resin 40 in the openstate recited above. Thereby, high fillability is obtained.

For example, the control of these operations is performed by thecontroller 60.

For example, the sensing by the sensor 50 is performed by sensing, at apath 10 q between the transfer part 31 and the cavity 10 c, at least oneof the temperature of the mold 10M, the pressure of the resin 40,reflected light at the mold 10M, or reflected light at the processingsubstrate 71.

For example, the sensing by the sensor 50 may be performed by sensing,at the path 10 p between the cavity 10 c and the suction part 10 e, atleast one of the temperature of the mold 10M, the pressure of the resin40, reflected light at the mold 10M, or reflected light at theprocessing substrate 71.

For example, the sensing by the sensor 50 may be performed by sensingthe position of the transfer part 31.

As shown in FIG. 1, a first pressure sensor 51 is provided in theexample. The first pressure sensor 51 senses the pressure of the resin40 at the path 10 q. A second pressure sensor 52 is provided in theexample. The second pressure sensor 52 senses the pressure of the resin40 at the path 10 p. A first temperature sensor 53 is provided in theexample. The first temperature sensor 53 senses the temperature of themold 10M at the path 10 q. A second temperature sensor 54 is provided inthe example. The second temperature sensor 54 senses the temperature ofthe mold 10M at the path 10 p.

For example, the pressure of the resin 40 changes when the resin 40passes through the various recesses provided in the mold 10M accordingto the depths of these recesses. The position that is reached by the endpart of the resin 40 can be determined by sensing the change of thepressure of the resin 40. For example, the temperature of the mold 10Mchanges according to the state of the resin 40 passing through thevarious recesses provided in the mold 10M. The position that is reachedby the end part of the resin 40 can be determined by sensing thetemperature change of the mold 10M. Also, the position that is reachedby the end part of the resin 40 can be determined by irradiating lightand by sensing the reflected light at the mold 10M or the processingsubstrate 71.

A transfer position sensor 58 is provided in the example. The transferposition sensor 58 senses the position (the position along the Z-axisdirection) of the transfer part 31. For example, the position of thetransfer part 31 changes according to the state of the resin 40 passingthrough the various recesses provided in the mold 10M. The position thatis reached by the end part of the resin 40 can be determined by sensingthe change of the position. The transfer position sensor 58 is includedin a portion of the sensor 50.

An example of the operation of the transfer molding apparatus 110 willnow be described.

FIG. 3 is a flowchart illustrating the operation of the transfer moldingapparatus according to the embodiment.

FIG. 4 to FIG. 8 are schematic cross-sectional views in order of theprocesses, illustrating the operation of the transfer molding apparatusaccording to the embodiment.

As shown in FIG. 4, the processing object 70 is disposed between thefirst mold 10 and the second mold 20; and these molds are closed. Then,the space between these molds is depressurized. At this time, theopening/closing part 12 is in the open state.

Subsequently, as shown in FIG. 3, the transfer part 31 is driven (stepS110).

In other words, as shown in FIG. 5, the plunger 32 is moved upward bydriving the transfer part 31. Thereby, the resin 40 is supplied to theinterior of the cavity 10 c.

As shown in FIG. 3, it is determined whether or not the resin 40 isfilled to a prescribed position (step S120). In the case of “No,” theflow returns to step S110. In the case of “Yes,” the flow proceeds tostep S130 described below.

For example, in step S120 as shown in FIG. 6, the position of the resin40 is sensed by the sensor 50 (the second pressure sensor 52, the secondtemperature sensor 54, the transfer position sensor 58, etc.). Forexample, the overflow of the resin 40 from the cavity 10 c is sensed.The state of the operation of the transfer part 31 may be modified basedon the sensing result.

As shown in FIG. 7, the resin 40 passes through the vent 10 v; and atleast a portion of the resin 40 reaches the intermediate cavity 10 d.For example, at this time, it is determined that the resin 40 is filledto the prescribed position. At this time, the opening/closing part 12(the shut-off pin) is set to the closed state. In the example, theshut-off pin moves downward and blocks the path.

Thus, the opening/closing part 12 is driven in step S130 FIG. 3. Inother words, the opening/closing part 12 is set to the closed state.

Then, as shown in FIG. 8, the resin 40 is further supplied with theopening/closing part 12 in the closed state. The resin 40 is filled intothe intermediate cavity 10 d.

As shown in FIG. 3, it is determined whether or not the appropriatetransfer operation is completed (step S140). In other words, forexample, it is determined whether or not the resin 40 is filled into themold 10M. Thermal curing of the resin 40 is started while applying ahigh filling pressure. Then, as shown in FIG. 3, the driving of thetransfer part 31 is stopped (step S150).

In the embodiment, when the average particle size of the filler includedin the resin is not less than 0.5 μm and not more than 3 μm, it isfavorable for the vent depth Dv to be, for example, not less than 40 μmand not more than 150 μm. When the vent depth Dv is less than 40 μm, thedam effect of the resin 40 is high; but the exhaust effect of the gas islow. When the vent depth Dv exceeds 150 μm, the exhaust effect of thegas is improved; but the dam effect of the resin 40 decreases. When thevent depth Dv is not less than 40 μm and not more than 150 μm, forexample, the dam effect of the resin 40 is high; and the exhaust effectof the gas also is high.

On the other hand, in the embodiment, when the average particle size ofthe filler included in the resin is greater than 3 μm (e.g., not lessthan 5 μm and not more than 6 μm), it is favorable for the vent depth Dvto be, for example, not less than 40 μm and not more than 200 μm. Whenthe vent depth Dv is less than 40 μm, the dam effect of the resin 40 ishigh; but the exhaust effect of the gas is low. When the vent depth Dvexceeds 200 μm, the exhaust effect of the gas is improved; but the dameffect of the resin 40 decreases. When the vent depth Dv is not lessthan 40 μm and not more than 200 μm, for example, the dam effect of theresin 40 is high; and the exhaust effect of the gas also is high.

FIG. 9A to FIG. 9F are schematic plan views illustrating the moldaccording to embodiments.

As shown in FIG. 9A, the runner 10 r, the gate 10 g, the cavity 10 c,the vent 10 v, the intermediate cavity 10 d, the suction part 10 e, andthe opening/closing part 12 (e.g., the shut-off pin, etc.) are providedin a first mold 10A. An intermediate vent 10 x is provided in theexample. The depth (the depth from the substrate clamping surface 11) ofthe intermediate vent 10 x is shallower than the vent depth Dv of thevent 10 v. The intermediate vent 10 x is provided between the cavity 10c and the intermediate cavity 10 d. The intermediate vents 10 x arearranged with the vents 10 v in a direction crossing the direction fromthe cavity 10 c toward the intermediate cavity 10 d. In the example, thevents 10 v and the intermediate vents 10 x are connected in parallel.The cavity 10 c and the intermediate cavity 10 d are connected by thesevents that are connected in parallel. By using the multiple vents havingdifferent depths, for example, the adjustment of the dam effect of theresin 40 and the exhaust effect is easy.

In a first mold 10B as shown in FIG. 9B, the diameter of theopening/closing part 12 (e.g., the shut-off pin) is substantially thesame as the width of the intermediate cavity 10 d. Thereby, for example,a higher dam effect of the resin 40 is obtained because the intermediatecavity 10 d is dammed and the suction part 10 e is dammed.

In a first mold 10C as shown in FIG. 9C, the vent 10 v extends along aside of the cavity 10 c and is provided to have a long length. Thereby,for example, the damming of the resin 40 is uniform in the plane (theX-Y plane); and the outflow of the resin 40 from the cavity 10 c can beuniform in the plane.

In a first mold 10D as shown in FIG. 9D, the intermediate vent 10 xcommunicates with the suction part 10 e without going through theintermediate cavity 10 d. Thereby, for example, in addition to theadjustments of the dam effect of the resin 40 and the exhaust effectbeing easy, the exhaust effect can be sustained even after theopening/closing part 12 is set to the closed state.

In a first mold 10E as shown in FIG. 9E, the intermediate cavity 10 d isprovided along a side of the cavity 10 c to have a long length. Themultiple vents 10 v that have narrow widths are provided between thecavity 10 c and a portion of the intermediate cavity 10 d. In thisconfiguration, for example, a higher dam effect of the resin 40 isobtained.

In a first mold 10F as shown in FIG. 9F, one vent 10 v is provided foreach of the multiple intermediate cavities 10 d. In this configuration,for example, the open/close states of the multiple opening/closing parts12 can be controlled independently according to the difference betweenthe flows of the resin at the multiple intermediate cavities 10 d.

Thus, in the embodiment, various modifications are possible for theconfigurations of the vent 10 v and the intermediate cavity 10 d.

The embodiment includes a transfer molding method. This method includesintroducing the resin 40 to the cavity 10 c of the mold 10M (the firstmold 10). The mold 10M (the first mold 10) includes: the substrateclamping surface 11 that contacts the surface 71 a of the processingsubstrate 71; the cavity 10 c that is recessed from the substrateclamping surface 11; the suction part 10 e that is recessed from thesubstrate clamping surface 11; the vent 10 v that is provided on thepath 10 p between the cavity 10 c and the suction part 10 e, provided tocommunicate with the cavity 10 c, recessed from the substrate clampingsurface 11 to the vent depth Dv, and used as the exhaust path of the gasinside the cavity 10 c; the intermediate cavity 10 d that is providedbetween the vent 10 v and the suction part 10 e on the path 10 p,provided to communicate with the vent 10 v, and recessed from thesubstrate clamping surface 11 to the intermediate cavity depth Dd thatis deeper than the vent depth Dv; and the opening/closing part 12 thatis provided between the intermediate cavity 10 d and the suction part 10e on the path 10 p and opens and closes the path 10 p.

The method according to the embodiment sets the opening/closing part 12to the closed state after at least a portion of the resin 40 passesthrough the vent 10 v and reaches at least a portion of the intermediatecavity 10 d. A transfer molding method that has good moldability can beprovided.

For example, to reduce the cost, it may be considered to eliminate theunder-fill resin filled into the gaps between the chip stacks includingTSV (thru-silicon via), and to perform collective filling using the moldresin. For example, there is a method in which the resin is filled whiledepressurizing the interior of the cavities of the mold and by operatingthe shut-off pin directly before the filling completion. However, in thecase where the viscosity of the resin is reduced to fill the narrowgaps, even when using such a method, resin leakage or unfilled portionsoccur easily. In the embodiment, by providing the portion (the vent 10v) that dams the resin in front of the shut-off pin, the operation ofthe shut-off pin can be delayed. Also, by providing the deepintermediate cavity 10 d between the vent 10 v and the shut-off pin, themargin of the timing of the operation of the shut-off pin can bewidened.

According to the embodiments, a mold and a transfer molding apparatusthat have good moldability can be provided.

Hereinabove, exemplary embodiments of the invention are described withreference to specific examples. However, the embodiments of theinvention are not limited to these specific examples. For example, oneskilled in the art may similarly practice the invention by appropriatelyselecting specific configurations of components included in molds suchas cavities, vents, intermediate cavities, suction parts, substrateclamping parts, opening/closing parts, and included in transfer moldingapparatus such as transfer parts, sensors, controllers, etc., from knownart. Such practice is included in the scope of the invention to theextent that similar effects thereto are obtained.

Further, any two or more components of the specific examples may becombined within the extent of technical feasibility and are included inthe scope of the invention to the extent that the purport of theinvention is included.

Moreover, all molds and transfer molding apparatuses practicable by anappropriate design modification by one skilled in the art based on themolds and transfer molding apparatuses described above as embodiments ofthe invention also are within the scope of the invention to the extentthat the spirit of the invention is included.

Various other variations and modifications can be conceived by thoseskilled in the art within the spirit of the invention, and it isunderstood that such variations and modifications are also encompassedwithin the scope of the invention.

While certain embodiments have been described, these embodiments havebeen presented by way of example only, and are not intended to limit thescope of the inventions. Indeed, the novel embodiments described hereinmay be embodied in a variety of other forms; furthermore, variousomissions, substitutions and changes in the form of the embodimentsdescribed herein may be made without departing from the spirit of theinventions. The accompanying claims and their equivalents are intendedto cover such forms or modifications as would fall within the scope andspirit of the invention.

What is claimed is:
 1. A transfer molding apparatus, comprising: a mold;a transfer part introducing a resin to the mold, and the transfer partconfigured to be movable between an initial position and a post-movementposition; and a sensor, the mold including a substrate clamping surfacecontacting a surface of a processing substrate; a cavity recessed fromthe substrate clamping surface; a suction part recessed from thesubstrate clamping surface; a vent being provided on a path between thecavity and the suction part, communicating with the cavity, beingrecessed from the substrate clamping surface to a vent depth, and beingused as an exhaust path of a gas inside the cavity; an intermediatecavity being provided between the vent and the suction part on the path,communicating with the vent, and being recessed from the substrateclamping surface to an intermediate cavity depth deeper than the ventdepth; and an shut-off pin opening and closing the path and beingprovided between the intermediate cavity and the suction part on thepath, the transfer part filling the resin into the cavity in an openstate of the shut-off pin, the sensor positioned between an input of thevent and the intermediate cavity and sensing that at least a portion ofthe resin has passed through the vent and reached at least a portion ofthe intermediate cavity, the shut-off pin being set to a closed stateafter the sensing by the sensor.
 2. The apparatus according to claim 1,wherein the sensing by the sensor includes at least one of: sensing, ata path between the transfer part and the cavity, at least one of atemperature of the mold, a pressure of the resin, reflected light at themold, or reflected light at the processing substrate; sensing, at thepath between the cavity and the suction part, at least one of atemperature of the mold, a pressure of the resin, reflected light at themold, or reflected light at the processing substrate; or sensing aposition of the transfer part.
 3. The apparatus according to claim 1,wherein the sensing by the sensor includes sensing, at a path betweenthe transfer part and the cavity, at least one of a temperature of themold, a pressure of the resin, reflected light at the mold, or reflectedlight at the processing substrate.
 4. The apparatus according to claim1, wherein the sensing by the sensor includes sensing, at the pathbetween the cavity and the suction part, at least one of a temperatureof the mold, a pressure of the resin, reflected light at the mold, orreflected light at the processing substrate.
 5. The apparatus accordingto claim 1, wherein the sensing by the sensor includes sensing aposition of the transfer part.
 6. The apparatus according to claim 1,comprising: at least two intermediate cavities, the shut-off pinincluding multiple shut-off pins, a first shut-off pin positioned at afirst position and a second shut-off pin positioned at a secondposition, the first position being provided between one of theintermediate cavities and the suction part on the path, the secondposition being provided between another of the intermediate cavities andthe suction part on the path, the sensor sensing that at least a portionof the resin has reached at least a portion of the one of theintermediate cavities or the another of the intermediate cavities, thefirst position or the second position being set to a closed state afterthe sensing by the sensor.
 7. The apparatus according to claim 1,wherein the mold including a gate being recessed from the substrateclamping surface to a gate depth, the cavity being provided at least apart between the vent and the gate, the vent depth being shallower thanthe gate depth.